Plasma Metal Etch.pdfVIP

11 How to Swallow a Mouthful of Data and Avoid Indigestion Barry M. Wise, Ph.D. President Eigenvector Research, Inc. 2 Outline ? The process monitoring data problem ? Example data set ? Approaches to preprocessing ? Variable means ? Warping for multi-way ? Data summary ? Comparison of results ? Conclusions 23 Plasma Metal Etch ? Linewidth (Critical Dimension) Control ? Constant linewidth reduction run to run and across wafer ? Constant linewidth reduction for every material in stack ? Minimal damage to oxide 4 Metal Etch Data Set ? Barna, G.G., White, D., Wise, B.M., Gallagher, N.B., Sofge, D., “Development of Robust Fault Detection and Classification Techniques/SEMATECH J-88E Project at TI”, SEMATECH AEC/APC Workshop VIII, Santa Fe, New Mexico, Oct. 27-30, 1996. ? White, D., Barna, G.G., Butler, S.W., Wise B., and Gallagher, N., Methodology for Robust and Sensitive Fault Detection, Electrochemical Society Meeting, Montreal, May, 1997. ? Gallagher, N.B.,Wise, B.M., Butler, S.W., White, D., and Barna, G.G., Development and Benchmarking of Multivariate Statistical Process Control Tools for a Semiconductor Etch Process: Improving Robustness Through Model Updating, IFAC ADCHEM97, Banff, Canada, 78–83, June, 1997. ? Wise, B.M., Gallagher, N.B., Butler, S.W., White, D., and Barna, G.G., A Comparison of Principal Components Analysis, Multi-way Principal Components Analysis, Tri-linear Decomposition and Parallel Factor Analysis for Fault Detection in a Semiconductor Etch Process, J. Chemometr., 13, 379–396 (1999). ? Wise, B.M., Gallagher, N.B., Butler, S.W., White, D., and Barna, G.G., Development and Benchmarking of Multivariate Statistical Process Control Tools for a Semiconductor Etch Process: Impact of Measurement Selection and Data Treatment on Sensitivity, IFAC SAFEPROCESS97, 35–42, Kingston Upon Hull, U.K., Aug., 1997. ? Wise, B.M., Gallagher, N.B., and Martin, E.B., “Application of PARAFAC2 to Fault Detection and Diagnosis in Semiconductor Etch,” J. Chemometr., 15(