Graphene-enhanced Cu composite interlayer for contact reaction brazing aluminum alloy 6061.pdfVIP
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Graphene-enhanced Cu composite interlayer for contact reaction brazing aluminum alloy 6061.pdf
Vacuum 136 (2017) 142e145
Contents lists available at ScienceDirect
Vacuum
journal homepage: /locate/vacuum
Short communication
Graphene-enhanced Cu composite interlayer for contact reaction brazing aluminum alloy 6061
Jun Lei Qi, Ze Yu Wang, Jing Huang Lin, Tian Qi Zhang, Ao Tian Zhang, Jian Cao, Li Xia Zhang, Ji Cai Feng*
State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China
article info
Article history: Received 7 September 2016 Received in revised form 21 October 2016 Accepted 23 November 2016 Available online 28 November 2016
Keywords: Contact reaction brazing Aluminum alloy 6061 Graphene Interlayer CVD
abstract
Contact Reaction Brazing of aluminum alloy 6061 using pure Cu nanoparticle interlayer usually encounters cracks and holes due to the intensive Al-Cu eutectic reaction. In order to solve these problems, here we report a new type of graphene-enhanced Cu composite (G-Cu) interlayer prepared by CVD to contact reaction braze aluminum alloy 6061. Results show that the G-Cu interlayer is conducive to retarding the intensive Al-Cu eutectic reaction. The average shear strength of the joint brazed with G-Cu interlayer reached 74 MPa.
? 2016 Elsevier Ltd. All rights reserved.
1. Introduction
Due to its good mechanical properties and machinability, aluminum alloy is one of the most lightweight thermal treatment strengthened materials. It has been successfully used in the industry of automobile, spacecraft and construction industries [1]. Most such applications will require joining aluminum alloys and several joining techniques have been developed [2]. However, characterized with low-deformation and high-precision, brazing appears to be the most attractive and proper method for joining complex components [3e5]. The conventional approaches for brazing aluminum alloys using Cu-based interlayer/?ller always encounter defects, such as holes and cracks, due to the intensive Cu-Al eutectic reaction. Thus, massive brittl
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