Effects of contact pressure, interface temperature, and surface roughness on thermal contact conductance between stainless steel surfaces under atmosphere condition.pdfVIP

International Journal of Heat and Mass Transfer 94 (2016) 156–163 Contents lists available at ScienceDirect International Journal of Heat and Mass Transfer journal homepage: /locate/ijhmt Technical Note Effects of contact pressure, interface temperature, and surface roughness on thermal contact conductance between stainless steel surfaces under atmosphere condition Ruifeng Dou ?, Tianran Ge, Xunliang Liu, Zhi Wen School of Mechanical Engineering, University of Science and Technology Beijing, Beijing 100083, China article info Article history: Received 14 July 2015 Received in revised form 9 November 2015 Accepted 19 November 2015 Available online 8 December 2015 Keywords: Heat conduction Thermal contact conductance Surface roughness Contact pressure abstract An experiment was performed to investigate the effects of interface temperature, specimen surface roughness, and contact pressure on thermal contact conductance (TCC). Specimens were prepared using SUS 304 stainless steel, the interface temperature was in the region of 360–640 °C, the contact pressure was between 2.39 and 15.17 MPa, and the surface roughness ranged from 0.25 lm to 2.00 lm. All experiments were conducted in ambient atmosphere. Results indicated that TCC presents a power law relationship with contact pressure and interface temperature. While the contact pressure exponent varied between 0.20 and 0.46 at different surface roughness, the interface temperature exponent showed a much wider range of 0.45–2.36. TCC increased more rapidly with temperature in specimens with higher surface roughness than in those with lower surface roughness. The correlation equations between thermal contact conductance, contact pressure, and interface temperature revealed a relative error of 20%. ó 2015 Elsevier Ltd. All rights reserved. 1. Introduction Thermal contact conductance (TCC), which is the reciprocal of thermal contact resistance (TCR), is frequently encountered in engineering applications, such as forging, heat