AlphaPresentationversion5-TexasInstruments.pptVIP

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AlphaPresentationversion5-TexasInstruments

AR7 – First Single-Chip ADSL Router 7 Years of DSL Know-How TI Is Committed to Single-Chip Solutions All Single-Chip Routers Are Not the Same Rest of Bill of Materials – Cost Comparison AR7 ADSL Router – System-View 3X Improved Downstream Throughput with TurboDSLTM Packet Accelerator Expanding Service Providers’ Networks Dynamic Adaptive Equalization ADSL2+, Delivering Extended Rates AR7 Silicon-Level Profile TI Supports 180+ Customers Worldwide AR7 Summary Competitive Feature Comparison Tested and Proven Interoperability Texas Instruments has committed significant resources, time, and effort to be the DSL interoperability leader AR7 Linux NSP Features * TI Proprietary – Covered under NDA TI’s AR7: The Evolution of ADSL CPE to Fully Integrated SOC Reduces subscriber churn for service providers Improves user experience, especially for home networking Adds subscribers that LECs previously couldn’t service Provides up to 25% lower system cost than current solutions Enables future proofing – supports today’s ADSL protocols and tomorrow’s increased throughput and reach protocols In-house 802.11 and VoIP capabilities for easy add-on of additional features Broadband Portfolio TI has over 7 years of end-to-end experience deploying CPE and CO solutions – Over 20M ports shipped End-to-End Experience We understand manufacturer and service provider requirements Customer Knowledge We know what to test and how to test and we build that into our silicon Silicon Expertise Interoperability Testing We rigorously test our DSL solutions for interoperability to reduce operators’ risk and ramp to volume efforts DSL Strengths Wireless More to Come . . . TI is committed to providing single-chip technology for wireless and wired communication Advanced process technology (130nm and 90nm) Digital and analog expertise Single-Chip DSL Router Single-Chip Bluetooth Single-Chip Cell Phone Wired 4 Not a complete system-on-a-chip Needs extra power supplies Increased BOM for external lin

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