DieAttach Set-up Procedure2.pptVIP

STEP 1- Prepare Necessary Logistics步骤1- 准备必要的配件 STEP 2 – Manually Input FPC/PCB Parameters步骤2-手动输入FPC/PCB参数 STEP 2 – Manually Input FPC/PCB Parameters 4). Press [Esc] to leave 按Esc退出. 5). Select 7 Save To Database to store the substrate parameters into the database if necessary 如果有必要,选7Save To Database将当前基板参数保存到数据库. F1= select F2= toggle Enter= OK Stop, Esc= cancel ^v= move cursor --= delete Note: User can select to store the data to either Drive C (C:\LFDB) or Drive A (Floppy Disk) 注:用户可自主选择将该数据存进C盘或是软盘. 6). Press [Enter] 按Enter. 7). Warning Message Confirm to Save Device Data? (Y/N() would be displayed, answer Y to update, then press [Enter] 出现提示信息”确认存储设备数据?”,选”Y”更新数据,Enter. 8). Select 9 Start Conversion to start substrate conversion 选”9开始转换”,进行基板数据转换. 9). Three warning messages Confirm Start Conversion? (Y/N), Change Downset? (Y/N), Home All Modules? (Y/N) would be displayed sequentially, answer Y to update 这时会相继出现3个提示信息:”确认开始转换?””改变下凹?””所有马达归位?”,选Y进行更新. 10). If fine adjustments are required , go to Setup Mode/ Indexer Workholder Menu/ Trk Wid/ Downset Offset. 如果需要调节的更好,进Setup Mode/ Indexer Workholder Menu/ Trk Wid/ Downset Offset. 11). Track width downset would go to home position first, then user to enter any offset values for the two variables 轨道宽度和下凹度首先会停在Home位置,拥护可通过输入偏移值来改变二者. 12). Press [Enter] to confirm the changes Enter确认改变. 13). Install suitable dispensing And bonding anvil blocks 装上合适的画胶针和anvil block. STEP 3 - Teach Dispense and Bond PRS步骤3-做画胶和Bond的PRS STEP 3 - Teach Dispense and Bond PRS步骤3-做画胶和Bond的PRS 9). Use joystick to adjust the drawn rectangle to the upper left corner of the die pad 用摇杆调整矩形框到die的左上角 10). Press [ENTER] to accept 按Enter接受. 11). Another messages Define Die Pad Adjust Upper Right Corner would be displayed 下面将会显示: Define Die Pad Adjust Upper Right Corner 12). Use joystick