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苏州工业园区职业技术学院
毕业设计（论文）
届
苏州工业园区职业技术学院
毕业设计（论文）任务书
系部： 电子工程系
设计（论文）题目：SMT设备及AOI测试 指导教师：李红益 职称：工程师 类别：毕业论文 学 生： 专业：班级： 设计（论文）的主要任务及目标 2、设计（论文）的主要内容
3、主要参考文献蔡建国：《电子设备结构与工艺》，湖北科学技术出版社年第版《SMT工艺及设备》 4、进度安排 设计（论文）各阶段任务 起止日期 1 2 收集资料 4.15 3 初稿完成 5.5 4 修订初稿 5.20 5 定稿 5.30 摘要
镶photo-mosaic image）。镶
关键词：
目录
一、概述 ····································································································1
（一）了解表面安装 ················································································1
（二）对表面安装元件装贴的实际考虑 ····················································2
（三）SMT流程框图 ················································································2
印刷机····································································································（一）按自动化程度分类················································································（二）按网版及印刷台的形式分类····································································5（三）按承印物形状分类················································································5（四）印刷时要注意的问题·············································································5三、贴片机····································································································
（一）贴片机类型·························································································
（二）表面组装工艺对贴片胶的要求·································································7（三）注意事项····························································································
四、回流焊····································································································（一）工作原理····························································································（二）一些不良原因分析················································································
（三）有关原因及解决措施····························
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