FPC检验规范..pptVIP

製品區域分類 導體線路 絕緣區域 表面處理 外型加工 補強加工 印刷區域 SMT * * FPC 檢驗規範 导体断线判定 NG Pattern open judge NG 导体短路判定 NG Pattern short judge NG 1.ILB部：Part of ILB a , x , y , z ≦1/3 P → OK 2.OLB部：Part of OLB a , x , y , z ≦1/3 P → OK 3.端子部：Part of connect a, x, y , z≦ 1/3 P→OK 4.油墨覆蓋部位：Ink covered area 造成短路判定NG Pattern residue under resist make short → NG z p a x y 线上缺口/针孔 Nick/pinhole on pattern 1.Part A：依據導體缺口規格判定 2.Part B: 2-1 b1,b3 须有最小焊锡残留量0.05 mm 以上 b1,b3 should has minimally remain above 0.05mm 2-2 b2 依穴徑公差判定 b2 judgement by hole tolerance 3.General Part： 缺口/针孔＜1/10 焊点面积 → OK Nick/Pinhole ＜1/10 Soldering area → OK a z x y w a2 a1 Part A Part C Part B b2 b1 b3 缺口 1.ILB部：Part of ILB a, x, y , z≦ 1/3 W→OK 2.OLB部：Part of OLB a, x, y , z≦ 1/3 W→OK 3.端子部：Part of connect a, x, y , z≦ 1/3 W→OK 4.油墨覆蓋部位：Ink covered area 造成斷路判定NG Pattern nick/pinhole under resist makr Open → NG 导体变色 pattern discoloration 1.保胶覆盖部位：Cover lay covered area 变色面积＞1/10 保胶覆盖导体面积 → NG discoloration area ＞1/10 Coverlay covered area→NG 2.导体露出部位：Pattern exposed area 2-1 变色面积＞1/10 导体露出面积 →NG discoloration area ＞1/10 pattern exposed area→NG 2-2 指紋判定 NG finger mark judgement NG 导体剥离pattern peeled off 1.保胶覆盖部位：Cover lay covered area 1-1 屈曲部位：Curved Part a≦1/3 W , b≦2 mm → OK 1-2.一般部位：General Part a≦1/2 W , b≦2 mm → OK 2.导体露出部位：Pattern exposed area a≦1/4 W , b≦2 mm → OK 保胶覆盖部cover-lay cover 导体露出部 pattern expose w a b 导体太粗、太細 pattern thick \ thin 不得超过 1/3 W No allowed over 1/3 W 导体裂痕判定 NG Pattern crack judge NG w w 保胶偏移 cover film misalign 1.保胶偏移 ≦0.3 mm → OK Cover film misalign ≦0.3 mm → OK 2.邻接导体露出 → NG the next pattern exposed → NG 保胶异物 cover film foreign material 1.导电性异物：依导体铜残规格判定 electric conductivity foreign material：judgement by pattern residue specification 2.非导电性异物： unelectric conductivity foreign material： 2-1 不可造成保胶剥离、不可跨3導體 Cover layer peeling and foreign material cross 3 patterns are not allow 2-2 造成制品凸起须符合厚度规格 conform to thickness specification if protrude