铜银合金导线的显微组织与性能.pdfVIP

第25 卷第6 期 中国有色金属学报 2015 年6 月 Volume 25 Number 6 The Chinese Journal of Nonferrous Metals June 2015 文章编号：1004-0609(2015)06-1655-07 铜银合金导线的显微组织与性能 1 1 2 1 文 姗 ，常丽丽，尚兴军，李胜利 (1. 山东大学 材料科学与工程学院，济南 250061 ； 2. 济南宝世达实业发展有限公司，济南 250061) 摘 要：利用光学显微镜和X射线衍射仪表征TAg0.1 铜银合金的显微组织，采用显微硬度计、电子万能试验机、 电导率测量仪等设备研究TAg0.1 合金的力学性能及电学性能，系统分析铜银合金导线成型工艺过程中挤压、拉拔 及退火等工序对TAg0.1 合金显微组织、力学性能和电学性能的影响。结果表明：拉拔处理后TAg0.1 合金的强度 和硬度较挤压态提高，但伸长率和电导率降低。经退火处理后，TAg0.1 合金的强度和硬度值均减小，伸长率和电 导率均增大。经挤压、拉拔、中间退火、拉拔的工艺后，获得的TAg0.1 空心导线硬度值为129.7 HV0.05 、抗拉强 度为400 MPa 、导电率为99.5% IACS 。 关键词：铜银合金；显微组织；力学性能；电学性能 中图分类号：TG146.1 ；TG359 ；TG379 文献标志码：A Microstructure and properties of Cu-Ag alloy wire 1 1 2 1 WEN Shan , CHANG Li-li , SHANG Xing-jun , LI Sheng-li (1. School of Material Science and Engineering, Shandong University, Jinan 250061, China; 2. Jinan Baoshida Industrial Development Co., Ltd, Jinan 250061, China) Abstract: The microstructures of TAg0.1 alloys were characterized by optical microscopy and X-ray diffraction. The mechanical and electrical properties of TAg0.1 alloys were studied by microhardness tester, electronic universal testing machine and conductivity indicator. The influence of producing procedures, such as extraction, drawing and annealing, on the microstructure, mechanical properties and electrical properties of TAg0.1 alloys in the molding process of Cu-Ag alloy wire was analyzed systematically.