回流温度对Sn-58Bi焊点显微组织及剪切强度的影响.pdfVIP

HotWorkingTechnology2019,Vol.48,No.17

回流温度对Sn-58Bi焊点显微组织

及剪切强度的影响

范鹏，赵麦群，孙杰，孙聪明

(西安理工大学材料科学与工程学院，陕西西安710048)

摘要：利用金相显微镜、扫描电镜(SEM)、能谱分析(EDS)等手段，研究了回流温度对Sn-58Bi焊点显微组织及

剪切强度的影响。结果表明：回流焊接后,Sn-58Bi/Cu钎焊接头的金属间化合物(IMC)层主要以Cu6Sn5相为主，IMC层

厚度随回流温度的升高而增加。Sn・58Bi焊点剪切强度随回流温度的增加呈先增加后降低的趋势。IMC层过厚，将导致

界面层脆性激增，产生裂纹，使剪切强度急速下降。回流温度在180°C〜200°C范围内时，剪切强度最佳。

关键词:Sn-58Bi；回流温度；IMC；显微组织；剪切强度

DOI:10.14158/j.cnki・1001-3814.2019.17.044

中图分类号:TG454文献标识码:A文章编号：1001-3814(2019)17-0168-04

EffectofReflowTemperatureonMicrostructureandShearStrength

ofSn-58BiSolderJoint

FANPeng,ZHAOMaiqun,SUNJie,SUNCongming

(CollegeofMaterialScienceandEngineering,XianUniversityofTechnology,Xian71004China)

Abstract:TheeffectsofreflowtemperatureonthemicrostructureandshearstrengthofSn-58Bisolderjointswere

investigatedbymeansofmetallographimicroscope,scanningelectronmicroscopy(SEM)andenergydispersivespectroscopy

(EDS).Theresultsshowthattheintermetallicompound(IMC)layerofSn-58Bi/CubrazedjointismainlyCi^Sihphaseafter

reflowsoldering,andthethicknessofIMClayerincreaseswiththeincreaseofreflowtemperature.Theshearstrengthof

Sn-58Bisolderjointsincreasesfirstandthendecreaseswiththeincreaseofreflowtemperature.IfthethicknessoftheIMC

layeristoothick,thebrittlenessoftheinterfacelayerincreasesandthecrackgenerates,andtheshearstrengthdropsrapidly.

Theshearstrengthisthebestwhentherefluxtemperatureisintherangeof180-200°C.

Keywords：Sn-58Bi;reflowtemperature;IMC;microstructure;shearstrength

回流焊是伴随微型电子产品的出现而发展起来