GB/T 44795-2024系统级封装(SiP)一体化基板通用要求.pdf

ICS31.200

CCSL56

中华人民共和国国家标准

GB/T44795—2024

系统级封装（SiP）

一体化基板通用要求

Generalrequirementsforintegralsubstrate

ofSysteminPackage（SiP）

2024⁃10⁃26发布2024⁃10⁃26实施

国家市场监督管理总局

发布

国家标准化管理委员会

GB/T44795—2024

目次

前言··························································································································Ⅲ

1范围·······················································································································1

2规范性引用文件········································································································1

3术语和定义··············································································································1

4总体要求·················································································································1

4.1通则·················································································································1

4.2文件优先顺序·····································································································1

4.3一体化基板类型··································································································2

5特性定义要求···········································································································2

5.1总则·················································································································2

5.2电气特性·······························································································