包覆型导电填料的制备及其对环氧树脂的导电性能影响工程管理专业论文.docxVIP

广东工业大学硕士学位论文电阻值影响。 广东工业大学硕士学位论文 电阻值影响。 关键宇：高分子导电材料；导电填料；化学镀；复合材料 万方数据 AbstractAbstract Abstract Abstract With the development of electronic industry becoming more and more quickly,the electromagnetic radiation harm also intensifies，which has become the third largest killer of the health hazard．So the requirement for electromagnetic shieldin91materials are growing demand for conductive filler．Non．metallic powder composite has the same function of metallic materials(such as electrical conductivity)．Not only he price and density of the non．metallic powder are low,but also the materials have high and low temperature resistance．Meanwhile has good high polymer material compatibility．So the metallization of inorganic non．．metallic materials used as conductive filler have good market prospects· Epoxy resin conductive adhesive is a kind of adhesive substance with certain conductive property after solidification or drying，which can realize electronic packaging and adhesion of materials，which consist of epoxy matrix，thinner curing agent filler．Epoxy resin conductive adhesive have a widely used． This topic are using mica powder,glass beads，copper powder,glass fiber as base material，using chemical preparation of silver plating composite filler．Optimizing the preparation technology,and finds the best conditions of electroless．Then put the conductive fillers into the epoxy resin testing conductivity The factors affecting the yield of target product were investigated follows： With mica powder core material，then use of two—step sensitization—activation pretreatment，using the method of chemical plating in the surface coating layer of silver． The optimized condition as follows：the dosage of coarsening is 209／L，the concentration of sensitizing liquid is 209／L，time is 20min，activate of liquid concentration is 39／L In the process of follow—up pH is 1 2，main salt concentration is 1 59／L，the concentration of glucose is 37．59／L，mica with silver nitrate mass ratio on the chemical quality i