电动汽车逆变器大功率IGBT模块新型封装技术研究-材料工程专业论文.docxVIP

ABSTRACT Electric vehicles, hybrid vehicles, fuel cell cars as the representative of New energy vehicles is one of the most important industries to achieve energy-saving emission reduction targets. IGBT module as the core of the new energy vehicles, its development has been widely concerned. Improving the packaging method is the key point. This article points out the defects of packaging materials presented in the packaging process of electric vehicle inverter for high power IGBT module, and introduces a new kind of connection materials, nano-silver paste. In order to verify the connection properties of nano-silver paste, to determine whether it is appropriate to be used in the manufacture of IGBT module, this paper designed a single analog chip sintering experiment. Through the micro X-ray tomography, shear test, scanning electron microscope, the connection layer sintered was full-range tested, results show that even though no obvious flaws was found in the connection layer, but shear strength was not very satisfactory. Analyzing suggests that the quality of magnetron sputtering coating may be not very reliable. The experiment went on with another connection experimental sintering use really chip and small silver-coated copper, the connection is good, the process of shear experiments, found the damage first appeared in the chip, this proves that the connection quality is reliable. So the nano-silver paste can be used in the manufacture of IGBT module. Next is to introduce the sintered nano-silver paste method to the making of IGBT module. Using the similar operation process as the single chip sintered as before, the whole module is sintered. The micro X-ray tomography presents the good quality of the sintered layer. The sintered module should go through the shell design and manufacturing, wire, glue, assembling process, so as to obtain the final product. The electrical specifications are measured by transistor tester. KEY WORDS ： Nano-silver paste ； magnetron s