单组份加成型绝缘导热硅橡胶的研究材料加工工程专业论文.docxVIP

单组份加成型绝缘导热硅橡胶的研究材料加工工程专业论文.docx

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单组份加成型绝缘导热硅橡胶的研究材料加工工程专业论文

哈尔滨工业大学工学硕士学位论文 哈尔滨工业大学工学硕士学位论文 -II- -II- Abstract With the miniaturization development of microelectronic packaging and IC, the demand of thermal conductive materials expands fastly. The thermal interface materials of silicone rubber are widely concerned due to the outstanding properties, such as aging resistance properity, high and low temperature durability, high voltage, wether resistance and electrical insulation and so on. In this paper, a high performance one component additional silicone rubber is developed, whose thermal conductivity (TC) is up to 1.08W/mK and Dielectric Breakdown Strength is above 13kV/mm. The study includes how the filler (single and mixed), methods of filler modification, catalyst and crosslinker affect the TC, shore hardness, curing temperature, shearing strength and insulation performance of this thermal silicone rubber, and it’s comprehensive performance is equal to Henkel 5404. Firstly, the effect of different fillers (single and mixed) on thermal performance is studied by testing the thermal conductivity with steady flow method. It is found that the descending sequence of thermal conductivity of thermal insulate adhesive with different fillers is AlN, Al2O3, ZnO in same conditions. Compared with thermal insulate adhesive with single fillers, the adhesive with mixed fillers can be improved significantly and the best ratio is 4:1. Secondly, it is found in filler modification research that the thermal insulate adhesive will be demixed if the filler is modified by overall blending method. While the phenomenon is avoided by alcohol water deposition method and the different of fillers between before and after being modified are analyzed by FTIR, XRD and SEM. Thirdly, it is found that with the increase of crosslinkers, the thermal insulate adhesive of the thermal conductivity decreases, the shoreA hardness decreases, the crosslinking density decreases, the curing temperature decrease and with the increases of catalyst, the thermal insulate

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