CVD_Process_Introduction汇.ppt

4. CVD film Application-DARC * DARC (Dielectric Anti Reflective Coating) * 4. CVD film Application-DARC * 4. CVD film Application-DARC Why Need Low K? ?RC Delay 4. CVD film Application-Low K * How to do Low K? ? Porosity Air is considered the perfect insulator. It has a dielectric constant of 1. One method of creating low-k dielectric materials is to introduce nanometer scale pores into a solid film to lower its effective dielectric constant. 4. CVD film Application-Low K * * Type EQP ID Tool Model Application Vendor HARP ATHRPA01 Producer GT STI/PMD AMAT HDP ATHDPN02 SPEED Max STI/PMD NVLS HDP ATHDPN01 SPEED Max STI/PMD NVLS SACVD ATOTSA01 Producer GT Spacer2 OX/SAB OX AMAT PECVD ATPSNN03 Vector Express Cu SIN NVLS PECVD ATFSGN01 Vector Express Cu SION NVLS PECVD ATFSGN02 Vector Express Cu FSG NVLS PECVD ATPSNN02 Vector Express Cu SIN NVLS PECVD ATPSNN01 Vector Express FEOL SIN NVLS PECVD ATNDCN01 Vector Express Cu NDC NVLS PECVD ATNDCN02 Vector Express Cu NDC NVLS PECVD ATTEON03 Vector Express Cu TEOS NVLS PECVD ATTEON02 Vector Express Al TEOS NVLS PECVD ATHSNA01 Producer GT Spacer2 SIN/SAB SIN/CESL AMAT PECVD ATPOXA01 Producer GT Cu MHM cap/ Pas OX AMAT PECVD ATTEOA01 Producer GT SMT SIN AMAT PECVD ATLKOA01 Producer GT Cu BD AMAT …… …… …… …… …… Current CVD tools list table in HuaLi * Thank you 谢谢 QA * Stress when island merge CVD Process Introduction Outline 1. CVD Process Introduction 2. CVD Type Classification 3. Dielectric Film Characteristic 4. CVD film Application-DARC and LowK 5. Q A * Outline 1. CVD Process Introduction 2. CVD Type Classification 3. Dielectric Film Characteristic 4. CVD film Application-DARC and LowK 5. Q A * 1. CVD Process Introduction * CVD(Chemical Vapor Deposition) : The process of depositing solid films using gases or vapors via chemical reaction on the substrate surface. Advantages of CVD : Good step coverage can be achieved Wide range of materials available Good composition control Good process control 1. CVD Process Int