光刻工作总结报告培训讲解.ppt

工作总结报告;Contents;光 刻 机 的 发 展;五 代 光 刻 机;;光 刻 机 的 发 展;光刻机的发展所伴随的参数变化 ;影响光刻机的一些因素;Resolution;;Wavelength of Lithography System ;我们目前所用光刻机的曝光 波长是390－450纳米 ;FOCUS AND DOF;FOCUS AND DOF;RETMAN PROGRAM;添加主要参数;Main functions;RETMAN PROGRAM;RETMAN PROGRAM;RETMAN PROGRAM;MODIFY RETICLE KEY DEFINITIONS C- CHANGE SINGLE CHIP A- CHANGE ALL CHIP K- ADD KEYS,LEFT ,RIGHT,BOTH,NONE O- ENTER A CHIP OFFSET D- DELETE CHIP E- ENLARGE VIEW R- ROTATE CHIP 90 DEGREE;KEY HAMS SCAN/ALIGN 1 PE INTERMIX Y WAFER RADIUS 75.00 KEY TO BSLN -0.1 ;光刻工艺控制;光刻工艺控制;光刻工艺控制;光刻工艺控制;光刻工艺控制;D. Print Bias: (What you see isn’t always what you get!) Print Bias = (Printed Feature Size) - (Mask Feature Size) Reasons: Underexposure, Overexposure, Underdevelop, Overdevelop;Add your company slogan