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Integrated thick-film hybrid microelectronics applied on…文档
See discussions, stats, and author profiles for this publication at: /publication Integrated thick-film hybrid microelectronics applied on different material substrates Article · Januar 2005 Source: OAI CITATIONS READS 5 29 5 authors, including: Caroline Jacq Thomas Maeder École Pol technique Fédérale de Lausanne École Pol technique Fédérale de Lausanne 69 PUBLICATIONS 347 CITATIONS 218 PUBLICATIONS 2,485 CITATIONS SEE PROFILE SEE PROFILE Hansu Birol CSEM Brasil 40 PUBLICATIONS 603 CITATIONS SEE PROFILE All in-text references underlined in blue are linked to publications on ResearchGate, Available from: Thomas Maeder letting ou access and read them immediatel . Retrieved on: 30 Ma 2016 EMPC 2005, June 12-15, Brugges, Belgium Integrated thick-film hybrid microelectronics applied on different material substrates C. Jacq, T. Maeder, S. Menot-Vionnet, H. Birol, I. Saglini and P. Ryser Laboratoire de Production Microtechnique, Ecole Polytechnique Fédérale de Lausanne BM – Station 17, CH-1015 Lausanne, Switzerland Tel. +41 21 693 58 23, fax +41 21 693 38 91, caroline.jacq@epfl.ch Abstract In this work, we have modified a low-temperature thick-film system previously developed for aluminium and aluminium alloy substrates in
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