LCM专有名词.pptVIP

* * Page * HannStar Confidential 模組MDL專有名詞list NP230 .姜歌 .Ver4 “ A ” Start: * ACF : Allotropic Conductive Film (異方性導電膜) * AOP : Acf On Pcb * AQL : Acceptive Quality Limited (允收水準) * AT : Approval Test (承認驗證) “ B ” Start : * B/L : Back Light(背光源) * BM : Black Matrix(黑色矩陣) * BGA : Ball-Gird-Array(球形封裝技術) * BOM : Bill Of Material(物料清單) “ C ” Start : * CCD: Charge Coupled Device * COB: Chip On Board * COF: Chip On Film * COG: Chip On Glass * CCFL:Cold Cathode Fluorescent Lamp(冷陰極射管) * CS : Customer Sample(顧客樣本) * CF : Color Filter(彩色濾光片) * CR : Commercial Release(量產移管) * CVD: Chemical Vapour Deposition(化學氣相成長) * CIP: Continuous Improvement Process(持續改善進度) * COA: Color filter On Array * CLCA:Close Loop Corrective Action (持續改善計劃) * CCL: Copper Clad Laminat(銅箔基板) * CP : Capability of Process(製程能力指數) * CRM: Customer Relationnship Maagement(客戶關係管理) * CIM: Computer Intergrated Manufacturing(電腦整合製造系統) * CAR: Corrective Action Report(查核改善跟催表) * CFT: Cross Functional Team(跨功能小組) “ D ” Start : * DAT : Design Approval Test(設計認定) * DVI : Digital Video Interactive(數位影像穿插) * DISM: Digital Interface Standards for Monitors * DFP : Digital Flat Panel port * DQAT: Design Quality Approval Test(設計品質認定) * DLP : Digital Light Processing(數位光學處理技術) * DCC : Document Control System(文件管理系統) “ E ” Start : * EMS : Equipment Management System(設備控管) * ES : Engineer Sample(工程樣本) * EMI : Electro Magnetic Interference(電磁波干擾) * ESD : Electro Static Discharge(靜電放電) * EMC : Electro Magnetic Contain(電磁相容性) * ERP : Enterprise Resource Planning(企業資源規劃) * EL : Electro Luminescent(電激發光) * EDID:Extended Display Identification Data(延伸顯示識別資料) * ECN : Engineering Change Notice(工程變更指示書) “ F ” Start : * FPC : Flexible Printed Circuit(軟性印刷電路) * FET : Field Effect Transistor(場效電晶體) * FI : Final Inspection(最終檢查) * FPD : Flat Panel Display(平面顯示器) * FQC : Finished goods Quality Control * FMEA: Failure Mode Effect Analysis(失效模式效應分析) “ G ” Start : * G/A : Gate Array * GVIF: Gigabit Video Inter Face “ H ” Start