LED 元件簡介.ppt

LED 组件简介 @@@@ 2010/1/24 目录 LED 芯片概论 LED Lamp Chip Type LED (SMD LED) 最近的发展趋势 LED 发光原理 Types of LED Chips GaP/GaP : Red/Yellow Green AlGaAs/GaAs : Red (UR,SR), IR GaAsP/GaAs: Red (SRD) GaAs/GaP : Orange GaAsP/GaP : Yellow AlInGap/GaAs :AS 四元(Red/Orange/Yellow) AlInGaP/GaP : TS 四元(Red/Orange/Yellow) InGaN/Saphire : Blue/Green (Nichia) InGaN/SiC :Blue/Green (Cree) LED Chip (H5C) LED Chip Spec AS/TS AlInGaP Chip Structure InGaN/Saphire Chip Structure 静电打穿现象 芯片供应状况 LED Lamp LED Lamp Color LED Lamp Spec. LED Lamp Spec. How to Make White LED LED Lamp Process 支架(Lead Frame) 固晶 (Dice Attach) 打线 (Wire Bonding) 模粒(灌胶模) 喷离模剂 注胶 沾胶与插入灌胶模 已灌胶之半成品 烘烤(50min)(Pre-Cure) 半成品 第一次切脚(正负极) 电性及外观检验 第二次切脚 分 Bin LED 封装常见问题 偏心(off center) 晶高不均 Open/Short 水气渗入 漏电 : IR, VF(100uA) PCB 污染 热应力不良 Lamp 供应状况(Display) Lamp 供应状况(交通灯) Chip Type LED Chip LED 制程 Chip LED 比较 LED 发光效率演进 First High Power LED 食人鱼 (Piranha) Introduced by HP Drive current : 70mA 加大散热机制 主要使用于第三煞车灯 High Power Package (LumiLEDs) Advantage of Power Package 三得 Agilent CotCo Nichia Nichia 供货商 4K3TRD-S/T 4K3RD-S HLMP-SD11 LO565THR4 NSPB546BS NSPG546BS NSPR546BS NSPB636AS NSPG636AS NSPR636AS 型号 120 120 120 120 120 120 120 70 70 70 角度 626nm-TS 626nm-TS 626nm-AS 626nm 波长 525nm 470nm 626nm-TS 470nm 525nm 626nm-AS SDL-5N3TR 30 626nm-TS 三得 SDL-5N3TY 30 592nm-TS CSL-U56204W-ET 30 626nm-TS 兴华 SDL-5N3SOS 30 605nm NSPW500BS 20 white NSPE510S 30 505nm Nichia 型号 角度 波长 供货商 PCB Type Chip LED Lead Frame Type Chip LED 银胶烘烤 固晶(Die Attach) 打线(Wire Bonding) Molding 测试 切割 分 Bin 银胶烘烤 固晶(Die Attach) 打线(Wire Bonding) 灌胶(Encap) 短烤(Cure) 长烤(Post Cure) 测试分 Bin PCB Type Lead Frame Type Potting Molding 制程 大(0805/1206) 小(0402/0603) 产品尺寸 佳 差 信赖性 Epoxy Molding Compound Material High Low Cost Lead Frame PCB Type 项目 Chip size 12 mil x 12 mil Power LEDs reduced LED count higher brightness better reliability lower costs Input power: 0.5 - 2 W Output Light:10 - 100 lm Chip size 40 mil x 40 mil Heatsink 15 C/W Thermal Resistance220 C/W Input power: 0.05 – 0.10 W