RoHS豁免条令总结（2006年-11-01）.pdfVIP

RoHS 豁免条令总结 （2006-11-01 ） （英文原版条令，中文翻译仅供参考） 2002/95/EC 1. Mercury in compact fluorescent lamps not exceeding 5 mg per lamp. 小型日光灯中的汞含量不得超过5 毫克/灯； 2. Mercury in straight fluorescent lamps for general purposes not exceeding: 一般用途的直管日光灯中的汞含量不得超过： Halophosphate—10 mg 盐磷酸盐— 10 毫克； Triphosphate with normal lifetime—5 mg 一般灯管中的三磷酸盐—5毫克； Triphosphate with long lifetime—8 mg 超长寿命灯管中的三磷酸盐—8毫克； 3. Mercury in straight fluorescent lamps for special purposes. 特殊用途的直管日光灯中的汞含量； 4. Mercury in other lamps not specifically mentioned in the Annex. 本附录中未特别提及的其它照明灯中的汞含量； 5. Lead in glass of cathode ray tubes, electronic components and fluorescent tubes. 阴极射线管、电子部件和发光管的玻璃内的铅含量； 6. Lead as an alloying element in steel contaiing up to 0.35% lead by weight, aluminum containing up to 0.4% lead by weight and as a copper alloy contaiing up to 4% lead by weight. 铅作为合金元素在钢合金中达0.35%，铝合金中达0.4%和铜合金中达4% ； 7. Lead in high melting temperature type solders (ie: tin-lead solders alloys containing more than 85% lead)， 高熔点类型焊料中的铅（即：锡铅焊料合金含铅超过85% ）； lead in solders for servers, storage and storage array systems (exemption granted until 2010)， 用于服务器、存储器和存储阵列系统的焊料中的铅（豁免准予至2010 年）； lead in solders for network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunication， 岛津(广州)检测技术有限公司 SHIMADZU (GUANGZHOU) ANALYTICTECHNOLOGY SERVICE CO., LTD. 用于通讯网络设备、电闸、信号发送和电送网络基础设备焊料中的铅； Lead in electronic ceramic parts (e.g. piezoelectronic devices). 电子陶瓷零部件中的铅（例如：压电陶瓷装置）（2005/747/EC 中有修改） 8. Cadmium plating except for applications banned under Directive 91/338/EEC (OJ No. L 186, 12 July 1991, p. 59) amending Directive 76/769/EEC (OJ No. L262, 27 September 1976, p. 201) relating to restrictions on the marketing and use of certain dangerous substances and preparations. 根据修改关于限制特定