copper nanoparticles for printed electronics routes towards achieving oxidation stability铜纳米粒子为印刷电子线路实现氧化稳定性.pdfVIP

Materials 2010, 3, 4626-4638; doi:10.3390/ma3094626 OPEN ACCESS materials ISSN 1996-1944 /journal/materials Review Copper Nanoparticles for Printed Electronics: Routes Towards Achieving Oxidation Stability Shlomo Magdassi *, Michael Grouchko and Alexander Kamyshny Casali Institute of Applied Chemistry, the Institute of Chemistry, the Hebrew University of Jerusalem, Jerusalem 91904, Israel; E-Mail: magdassi@cc.huji.ac.il Received: 22 July 2010; in revised form: 18 August 2010 / Accepted: 1 September 2010 / Published: 8 September 2010 Abstract: In the past few years, the synthesis of Cu nanoparticles has attracted much attention because of its huge potential for replacing expensive nano silver inks utilized in conductive printing. A major problem in utilizing these copper nanoparticles is their inherent tendency to oxidize in ambient conditions. Recently, there have been several reports presenting various approaches which demonstrate that copper nanoparticles can resist oxidation under ambient conditions, if they are coated by a proper protective layer. This layer may consist of an organic polymer, alkene chains, amorphous carbon or graphenes, or inorganic materials such as silica, or an inert metal. Such coated copper nanoparticles enable achieving high conductivities by direct printing of conductive patterns. These approaches open new possibilities in printed electronics,