led陶瓷封装 2011（led陶瓷封装 2011）.docVIP

led陶瓷封装 2011（led陶瓷封装 2011） This paper contributed by yunyunyisheng. Pdf document may at the WAP end of the browsing experience poor. Suggest you select TXT, or download the source file to the machine view. LED On Ceramic 2011-01-09 Outline? Introduction of Ceramic 1, Package 2, Ceramic LED Products Information? 3, Conclusions 1, Features of Ceramic LED package 2, Ceramic Materials Properties 3, Kinds of Ceramic substrate Type of ceramic substrate is common at this stage there are HTCC, LTCC, DBC, DPC four. HTCC HTCC is also called high temperature cofired ceramics, belongs to the technical development of the early embryo, must be in the drying of high temperature of 1300~1600 DEG C environment, then drill holes to fill the hole, screen printing technology and printed circuit, because of its co firing temperature is higher, the limited metal conductor material, its main the material for the high melting point but poor conductivity of tungsten, molybdenum and manganese... The metal, then stack sintering. LTCC (Low-Temperature Co-fired Ceramic) DBC (Direct Bonded Copper) DBC is directly connected to the copper substrate, the high insulation of Al2O3 or AlN ceramic substrate coated on one side or two sides of copper metal, through environmental heating high temperature of 1065~1085 DEG C, the copper metal produced by high-temperature oxidation, diffusion and Al2O3 material (Eutectic) Eutectic melt, the bronze and ceramic bonding, forming a ceramic metal composite the substrate, according to circuit design, the etching preparation line. DPC (Direct Plate Copper) DPC also known as direct copper substrate, the ceramic substrate pretreatment cleaning, using thin film manufacturing technology - vacuum coating on ceramic substrate sputtering with copper metal composite layer, followed by photolithography of photoresist coating exposure, development and etching, to complete the film process line making, and finally to electroplating the way / electroless deposition increase li