Thermal Design Guide for DSP and ARM （热为DSP和ARM设计指南）.pdf

Application Report SPRABI3A– May 2015– Revised August 2016 Thermal Design Guide for DSP and ARM Application Processors CatalogProcessors ABSTRACT This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal requirements and thermal management necessary to assure proper operation of the processor. Failure to establish and maintain the minimum requirements identified within this document (and the related data sheet) can reduce the life, reliability, or performance of the processor. Under certain conditions, exceeding the thermal requirement can permanently damage the processor. In all cases, if the thermal requirements identified in this document and the device-specific data sheets are not met, any warranty - implied or otherwise stated - will be null and void. Contents 1 Introd