Separable iNEMI（可分iNEMI）.pdfVIP

- Page 2 - CO N NECT O R MA R KET : CO N NECT O R MA R KET • $39B Worldwide: ~ 6.5%/yr Growth/Cyclical Track Record. • Split : Test/Burn-in Sockets 10%, Production Connectors Sockets = 90%. These are two distinctly different markets, with different customers players. • Metallic Connectors : (Cu, Brass, PhBr, BeCu ), Fiber Optic Connectors: (Glass, POF), Electronic: 5v Electrical: 12v. • Maj or Markets: Computer, Comm, Auto. Mil-Aero, Industrial, Consumer, Appliance, Medical, Instrumentation, Other. • True Connectors : Separable Mechanical Electrical Connection:  Level 0 = On-Chip, (Sub-Micron on-chip Al/Cu Interconnects)  Level 1 = Chip-to-Package (Wire Bond, C4)  Level 2 = Chip Pkg to Board (DIMM Socket)  Level 3 = PC Board (PCIe)  Level 4 = Board-to-Board, Chassis/Subsystem (Backplane Connector)  Level 5 = IO Panel (USB)  Level 6 = Intersystem (Ethernet Cable) Level 0 1 (ULSI, SiP, SoC) impact Packaging Interconnect. Net Result : Fewer Discrete Connectors/Function, but More Functions, Applications Systems. This = Connector Growth @ ~ 1/3 less than ICs. 2 KEY PO I NT S A BO UT T HIS MA RKET : KEY PO I NT S A BO UT T HIS MA RKET • 100s of small to mid-sized companies. • Tyco, Molex, Amphenol, FCI, Delphi, Yazaki, JST, Foxconn. $1B in Sales. • Top 10 between 50% 55% of TAM. • Industry Consolidation will Continue. Most recent Maj or: FCI/Bain Capital • Globalization of the Supply Chain is increasing. • Mfg Footprint is Shifting to Asia to Support OEM/EMS Assembly. • Market ~