Interconnect Technology EMS（互连技术EMS）.pdfVIP

Interconnect Technology EMS • Advanced assembly on organic and ceramic substrates • Printed Circuit Boards and packaging substrates • LTCC substrates • Test services Interconnect Technology EMS MST Group has extensive experience in designing and manufacturing qUALITY electronic modules for medical devices and other high-reliability applications. The quality system of the MST Group derives from the stringent require- DYCONEX AG, an MST company located in Bassersdorf, Switzerland is an ments of life sustaining implants and expert and technological leader in HDI/microvia substrates based on flex, assures 100% traceability of processes rigid-flex and rigid technology. and materials. Micro Systems Engineering GmbH, an MST company located in Berg, Germany is the leading European manufacturer of complex LTCC substrates and offers a wide variety of advanced assembly and semiconductor packaging MICRO SYSTEMS processes on both ceramic and organic substrates. TECHNOLOGIES Micro Systems Technologies Group Micro Systems Engineering, Inc, an MST company located in Lake Oswego, USA, (MST) comprises five technology com- offers services in the design of electronic modules and implantable devices panies providing innovative p