CostEffective Entry into Laser Direct Structuring （成本效益的进入激光直接构建）.pdfVIP

Cost-Effective Entry into Laser Direct Structuring (LDS) LPKF Fusion3D 1100 A simple plastic clip integrates conductive paths and becomes a smartphone antenna: the LPKF LDS process leads to new product designs and introduces new and efficient forms of production - from a single component to mass production. 2 Introducing New Manufacturing Methods for 3D Circuitry Smaller, more complex, more compact. Modern electronics present manufacturers with great challenges. LDS components offer an effective way to overcome these challenges, turning simple plastic components into high-quality 3D interconnect devices. The LPKF Fusion3D 1100 provides cost-effective access to this technology, and is ideal for small batches or 3D prototyping. In today’s electronics labs, an increasing number Laser direct structuring (LDS) has attained a market share of functions must be accomplished in a constantly of more than 50 percent among production methods, and dwindling space. As a result, components like plastic the trend is rising. For example, at the beginning of 2010 clips, panels and housing parts, which previously a production capacity of 60 MM smartphone antennas served a purely mechanical purpose, are now taking on was installed. This capacity rose at the beginning of 2011 electronic functions. Injection moldings are the basis to 180 MM. Other markets are experiencing rapid growth for these three-dimensional interconnect devices, also including the automotive industry, medical technology known as molded interconnect devices (MIDs). and the consumer field. The LPKF Fusion3D 1100 provides a cost-effective and flexible entry into this rapidl