Leadfree Soldering Capability Evaluation Kit （无铅焊接能力评估工具）.pdf

The Industrial Standards Division of Hong Kong Productivity Council is pleased to introduce the new Lead Free Soldering Capability Evaluation Kit. This new evaluation kit consists printed circuit boards of various surface finishes and different types of surface mounted and through-hole components for the reflow and wave soldering processes. In addition, we also offer reliability evaluation of the solder joints on finished test boards. With our comprehensive evaluation kit and reliability testing service, you can easily validate your lead-free soldering process capability and therefore can be confident to meet the industry standards. The evaluation kit contains: LEAD FREE PCB Size 10 in. x 11 in. Thickness 1.6 mm Layer Double-sided Material FR4 Halogen-free FR4 Surface Finish Organic Solderability Preservative (OSP) Electroless Nickel Immersion Gold (ENIG) Immersion Tin Immersion Silver LEAD FREE COMPONENTS SMT Chip Resistors (0402, 0603, 0805, 1206) Chip Capacitors (0603) SO-20 (50mil pitch, 300mil body width) SO-28 (50mil pitch, 300mil body width) PLCC-68 (50mil pitch, 25 x 25mm body size) QFP-48 (0. 5mm pitch, 7 x 7mm body size) QFP-100 (0.5mm pitch, 14 x 14mm body size) QFP-176 (0.5mm pitch, 24 x 24mm body size) QFP-208 (0.5mm pitch, 28 x 28mm body size)