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环氧树脂胶粘剂的常用配方(The common formula of epoxy resin adhesive)
环氧树脂胶粘剂的常用配方(The common formula of epoxy resin adhesive)
The common formula of epoxy resin adhesive
Formula 1:
618# 100, DTA 8, DBP 20, AL2O3 (200 mesh) 100
Curing conditions: (MPa) the pressure / temperature / time (H) 0.05/20 C /24h tau =18MPa applies to metal glass and ceramic bonding.
Recipe two:
618# 100, two ethyl alanine, 8 DBP, 20 AL2O3 100
0.05/20 C /48h tau 20MPa use.
Recipe three: HYJ-6#
618# 100, DBP 15, AL2O3 25, 2#SiO2 2-5, 12, four, ethylene, five amines
0.05/20 /48h AL/ steel 20MPa, suitable for bonding of metal / glass fiber reinforced plastic.
Recipe four:
618# 100 benzene, two amines, 18 600# diluents, 10 resorcinol 10
0.05/20 C /24h C =5.0MPa =17.5MPa tau tau 200 heat resistant adhesive joints.
Recipe five: 913#
Group A: 601# epoxy 600# diluent, 201# polyester aluminum powder and quartz powder
Group B: BF3 ether, tetrahydrofuran, A3PO4, A:B=10:1
0.05/15 C /6h =19MPa low temperature fast curing suitable for cold regions.
Recipe six:
Tetrahydrofuran polyether epoxy 5 590# curing agent KH-550 0.2
0.05/30 C /30h C =21MPa tau tau -196 6.5MPa is suitable for ultra low temperature metal bonding.
Recipe seven: 508#
6101# epoxy 100 647# anhydride 60 TiO2 50 glass powder 50
0.05/150 C /3h =13.1MPa =26.7MPa steel is suitable for the tau tau metal bonding.
Recipe eight: 618# 100
Phthalic acid two, anhydride 40, polyester resin 20, AL2O3 50
0.05/140 /4h, 20MPa tau tau C 150 C =8-10.0MPa use.
Recipe nine:
618# 100 650# polyamide
0.05/20 C /24h 100-120 tau 15MPa for metal ceramic bonding wood plastic.
Recipe ten: KH-514#
Group A: 618#, 2000# epoxy resin
Group B: 651#, polyamide, DMP-30, KH-560, mixed amines (two - 4,4, two amino two benzene)
A:B=12:7
0.05/60 /3h is more than 25MPa DEG C for metal bonding.
Formula Eleven: J-11# glue
6101# epoxy resin, 120 200# polyamide, 100 600# diluent, 24 benzene, two amines, 6.5 KH-50 2.5
0.05/20 C /24-36h -120 C =15Mpa 20Mpa tau tau tau 120 C =3.0 ~ 4.0Mpa metal bonding.
Formula twelve: 250# glue
4,4- two hydroxy two ph
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