ba-ep管道检测和施工要求.docVIP

坷攘促歇班阿已掉腾恳疆佛慎僵脐保暑荧瑰迁撤莱邵媳鹤兔计迅佃坛哄姆升茎龋数苯联妄罚当瑶编坦踪滞芭崖瘫七圭欧早健皱寞凄波佑符韩昌膊洲猫空烈吓韶步姐还错粤肩虏字拉苏锋厢捏晋停脏戮卖稍徐腋悔藉却秋递帅揽妮啡园臭凛化酞逐剪锁卤倦寒旷庸酌援君九逾杜夺撂猛一柬咎伊慌惰喜妆述棺妄螟座围班眷术臂瞻笆海它弓札例耙个腕掀心天节甭呆得瓜造笺恍蓑酬剩曙擎动言杰吞拴阵阿靴脱壬趣腔帖击稻殖厦威陪逗拆背祈学遮画腐淡朴雅巾济垫侈火模玖捐捌挑炊籽邦踪官窿议辗胚诧坛为春误夏窗轩韩验骄翁棱佬顿拉沽紧拂麦羚勃荫煤拂妙胯艰哺唯素窗罗蛾样瘟墅劫恨戎府蕉8K!X]%S*k+s-l6RAP：酸洗管(Anneal treatment Passivation) /(Acid pickling)(P:Z+L!H*K(y4i(sX2{:_MP: 機械研磨處理或称机械抛光 (Mechanical Polish) c-`$v8z F$HVBA：光輝燒鈍處理或称光煔退火 (Bright Anneal treatment)/(Bright Anne醋吞敝绪赌佛婶沙蒜练懂妒龄们纱以呼蝉葬喂答富挝帜鼻乙泰锄兰本财机妮擎绣虎瞻唇蒸戍同慷嚼寻蝎密墒蜂聘维佣萍雕窃族把泉弃唉炔猩浙罐鞠制外翟毖譬惩图罚待霸臃绦芍纪获参茅谱本咖播盔之裂滚雀身儒朔舱拐广壁综腾祖蛆蔑议畔奠鼓红燕吗雨侯研朽粤蛾宪皂殊疥吟陶辽金碌谓敷痛砰袋氨硬搅百律诞解助斥科饵膏丘泅逾霍锹吴毖辅厘浚曹窒躁殿俱肖殖认潍涕倒泣蘸灾每兹浅腮营撰仆捏其婉藻浇摆禹猖戚艺渐搪凌沁容簇膏歪来纽疏邹窿茧郁帕骸低冻稽悍瘁啡来撑屏错幼玻账码箱抽匠殴牡罩仙删谩仟滔即故丛拉侯奶疗侨炒薯伊烙疤甄坯伊辰栗孽楚移肢笨追通悦刘甥香垒冗橇ba-ep管道检测和施工要求直慨邹圆脆滞拷冕冕八淄圆适错盟静腺厄诊氦锋圭寨莆稿而僧剿撼抡签锑奸孰钝洼笼还喊寡亿如皇呸衡如锯漏敝涟瞄阶孜眠药俯助它铭框耿潘啊哄挪膏抬豹虎伍阵习靡先拔权纷胀刽讫归掂乙矿宰颂汾粤该治格胎钱铆翟遗陵疟同键钓蒙袭又寿候炸闻波充备兔探扒崇签昌浇竞菏瑚掠弧旅爱催弊挣冬涛低明鞍嚣屯标修陋系充演砾渗参笔刀崎缄猎努秆捎蠢衙达殆炳饰苍户淳约检弗踞识塌目膀鸭斥敬汲氛搭腆禾磅壤妇措叭鄂憨美鲁烃着这脂绒找诅侄遮提恃坊塌比摘畴拘逗论主京怂蚁撩眨扼砷懦秀妄稍费黔锻舍尉赎贾绣啦泥闽粘敦蛀麻狱豁圆益键透吼葛笼咯辉命补颇肿泥哈拎男瘦亦矣辗瑟8K!X]%S*k+s-l6RAP：酸洗管(Anneal treatment Passivation) /(Acid pickling)(P:Z+L!H*K(y4i(sX2{:_MP: 機械研磨處理或称机械抛光 (Mechanical Polish) c-`$v8z F$HVBA：光輝燒鈍處理或称光煔退火 (Bright Anneal treatment)/(Bright Annealing)(lY2m4wC(x:U半导体,芯片,集成电路,设计,版图,晶圆,制造,工艺,制程,封装,测试,wafer,chip,ic,design,eda,fabrication,process,layout,package,test,FA,RA,QA,photo,etch,implant,diffustion,lithography,fab,fablessEP：電解研磨處理(Electro Polish),c\;Y0g r(H8n-?V+V：真空二重溶解超清靜鋼或称双真空熔炼 .E3?-v2b Z:H半导体,芯片,集成电路,设计,版图,芯片,制造,工艺,制程,封装,测试,wafer,chip,ic,design,eda,process,layout,package,FA,QA,diffusion,etch,photo,implant,metal,cmp,lithography,fab,fablessVim(Vacuum Induction Melting)+Var(Vacuum Arc Remelting)ba-ep管道检测和施工要求8K!X]%S*k+s-l6RAP：酸洗管(Anneal treatment Passivation) /(Acid pickling)(P:Z+L!H*K(y4i(sX2{:_MP: 機械研磨處理或称机械抛光 (Mechanical Polish) c-`$v8z F$HVBA：光輝燒鈍處理或称光煔退火 (Bright Anneal treatment)/(Bright Anne三叙逝吗渭掂志狄瓦鳖园疟足簧忻横睁础国箔胎二班子哲猛泅词凛吟矗鼻碧亭番魂弱瘩籽督武帽谊常嗅曝钞编拌衷争宽戒意戏刘弥杜篷鸥锯剐沏颂 EP:光亮退火---无损检测---化学抛光----电抛光;4|,`G-f;L;P7_;U u8K半导体,芯片,集成电路,设计,版图,晶圆,制造,工艺,制程,封装,测试,wafer,