磨片工艺原理 Backgrind process概要1.ppt

doritos\GS Technology Symposium\Presentation for GS Symposium_v3.ppt doritos\GS Technology Symposium\Presentation for GS Symposium_v3.ppt Backgrind process Backgrind process Backgrind process Backgrind Tape: Non – UV Tape UV Tape Backgrind process Backgrind process THICKNESS MEASURING Backgrind process Backgrind process Backgrind process Backgrind process Backgrind process Backgrind process Backgrind quality: 1. Thickness and TTV 2. Edge chipping 3. Roughness 4. Warpage 5. Die strength Backgrind process Die strength test method Backgrind process * your partner in analog, connecting you with the digital world * Backgrind process Zhu Xin 12 July 2005 Backend process flow: Taping Backgrinding Detaping Thickness measuring Mounting Sawing SEZ Backmetal Taping Backgrinding Thickness measuring Stress relief Detaping Backside clean Backmetal GRIND DFG850 8”wafer capability 2 spindles 3 chucks table High Accuracy Height Gauge and completely closed loop Z-axis control system Minimizing wafer to wafer thickness variation Two probe gauge is standardized on DFG850 Wheel Recipe (grinding conditions) Tape selection Machine specification Advanced grinding technology Optimal condition Wheel Base Backside 　 　 8/16 #1200 2/4 #4000 8/20 #1000 2/6 #3000 10/20 #800 4/6 #2000 20/30 #600 4/8 #1700 30/40 #400 5/10 #1500 40/60 #360 5/12 #1400 　 #320 Grit Size(um) Mesh Size Grit Size(um) Mesh Size Grit Size IF-01-1-4/6-B-K04 Wheel Basic Elements Base jig Chip φ 7 R5 Ground surface downside Die strength test jig Cr