树型微通道网络芯片热沉的试验研究-USC.PDFVIP

43 10 上 海 交 通 大 学 学 报 Vol. 43 No. 10 2009 10 JOU RNAL OF SH ANGHAI JIAOT ONG UNIVERSITY Oct. 2009 : 1006-2467( 2009) 10- 1649-0 洪芳军, 郑 平, 常欧亮, 吴 晟 ( , 200240) : 微通道热沉是解决高热流密度微电子芯 散热的一种有效途径. 利用微电子加工技术在 硅 上制作了具有树型微通道网络的电子芯 热沉, 在加热面上集成了微型Pt 薄膜电阻式温度传 感器并用来测量加热面的温度分布, 搭建了微通道热沉性能测试试验平台, 进行了热沉的流动和传 热性能测试. 结果表明, 本试验研究结果和已有的数值模拟结果相吻合, 从而验证了树型微通道的 优越性和应用的可行性. : 树型微通道网络; 微电子芯 ; 热沉; 传热性能 : TK 121 : A Experimental St udy on a Tree- Shaped Microchannel Network Heat Sink for Microelectronic Cooling H ON G Fang-j un, CH E N G P ing , CH A N G Ou-li ang , W U Sheng ( Key Laboratory for Pow er M achinery and Engineering of M inistry of Education, Shanghai Jiaotong U niversity , Shanghai 200240, China) Abstract M icrochannel heat sink is a promising technique to dissipate high heat flux microelectronic chips in the near future. A silicon-based heat sink w ith tree-shaped microchannel netw ork for the cooling of m-i croelectronic chips w as fabricated using micro electromechanical system techniques. Pt film thermo-resis- tors w ere also integrated on the heating surface to measure the surface temperature distribution. An exper- imental setup was built to test the pressure drop and thermal performance of the micro heat sink. T he re- sults show that the experimental data agree very w ell w ith the previous 3-D numerical simulation. And, the advantages of the tree-shaped microchannel netw ork over parallel microchannel are verified. Key words tree-shaped microchannel netw ork; microelectronic chips; heat sink; thermal performance [ 1] , , . : ¹ , , ; º . , , . 1981 , T