光刻工艺培训教程(国外英文资料).doc

光刻工艺培训教程(国外英文资料) A master. 1. what is the photo? The quality of lithography in general what is required? Is the geometry of lithography mask film version of the transfer to the surface of a silicon wafer coated with a layer of photoresist process. The quality of the general requirements for lithography: The width of line with the indicator. The overlay accuracy meets the requirements The thickness of photoresist comply with requirements The defect free Has a good corrosion resistance of the rubber pattern 2. in the process of our production line, generally those who have a photolithography process? Which is why the key layer, called the key layer? The different process, lithography levels may vary, a typical 1 micron single poly double aluminum process generally requires a level of lithography as follows: Well, the active region, a note, polycrystalline, N-LDD, N+S/D, P+S/D, contact hole, hole, hole, metal -1, -2 metal, passivation hole. Among them, the active region, polycrystalline, contact hole, hole, metal metal -1, -2 called the key layer. It is called a key layer, because the lithography of these levels: The direct impact on the electrical properties of the device or the finished product rate has a significant impact The width of the most stringent requirements The overlay accuracy the most stringent requirements 3. typical lithography process. A typical lithography process for: Pretreatment, coating of silicon surface (to the side), before baking, (para) exposure to PEB after baking, baking, developing, explicit inspection (measurement) Two. Coating pretreatment Why viscosify 1. glue? General can use hydrophilic / hydrophobic theory to explain it. Because the absorbent substrate surface has hydroxyl groups, the photoresist and the silicon surface hydrophilic hydrophobic to good combination. The usual method is to remove the surface OH groups using hydroxy getter chemical method, generally uses alkylsilane compounds, such as HMDS. 2. use the oven HMDS thickeni