挠性电路板技术的现状和发展趋势_刘尧葵.pdf

挠性印制板 FPC 挠性电路板技术的现状和发展趋势 刘尧葵 徐 勋 唐幸儿 （江门职业技术学院，广东 江门 529090） 摘 要 文章论述了挠性电路板技术的现状，由于无粘结层挠性覆铜箔基材和感光显影型保护膜的成功开发和应 用，使挠性电路板的生产走上了可量产化的轨道。指出现有挠性电路板的制造技术是制约挠性电路板技术发展的瓶 颈。目前挠性电路板技术的广泛应用仍面临着一些困难，在不久的将来，感光显影型覆盖层的开发和应用，会给挠性 电路板技术的发展带来巨大的变化，它具有广阔的应用前景，必将在市场上大放异彩。 关键词 挠性电路板；现状；发展趋势 中图分类号：TN41 文献标识码：A 文章编号： 1009-0096（2009）10-0031-03 Current Situation and Development Trend of Flexible Circuit Board Technology LIU Yao-kui XU Xun TANG Xing-er Abstract In this paper, the current situation of flexible circuit board technology is described. As the successful developing and application of non-cohesive layer of fl exible with copper foil parent metal and protection layer with sensitive developing type, the production of fl exible circuit board can be embarked on mass production orbit. The paper points out that the bottle neck to restrain the development of flexible circuit board is current production technology of fl exible circuit board. Currently the wide application of fl exible circuit board technology still has some diffi culties. In the near future, the development and application of protection layer with sensitive developing type will give a great change to the developing of flexible circuit board. It has a wide application prospects, will certainly shine in the market. Key words Flexible Circuit Board; current situation; development trend 0 引言 口已能很好正常生产，因此挠性电路板的地位和量 目前，由于无粘结剂型挠性覆铜箔基材和感光 产化已明显地增加了。目前，挠性电路板在军事、 显影型保护膜的成功开发和应用，使挠性电路板的 航天航空、汽车和超精细节距应用方面已得到应 31 生产走上了可量产化的轨道。加上挠性电路板在精 用，进一步的发展趋势是刚性和挠性结合起来形成 细或超精细节距（线宽/ 间距）方面的优势，具