Ni_P化学镀层正交实验设计及形貌结构分析.pdfVIP

第 24卷 　第 11期 电镀与涂饰 Electrop lating Finishing Vol. 24　No. 11 　　收稿日期 : 2005 - 06 - 30　　修回日期 : 2005 - 07 - 14 　　作者简介 :梁平 (1974 - ) ,男 ,硕士 ,讲师 ,研究方向为材料的腐蚀 与防护技术。 　　作者联系方式 : ( Email) liangp ing770101@163. com N i2P化学镀层正交实验设计及形貌结构分析 梁平 , 　吴敏 , 　马文涛 (辽宁石油化工大学机械工程学院 ,辽宁 抚顺 　113001) 摘 　要 :在温度、pH、装载比、施镀时间和复合添加剂的质量浓 度一定的条件下 ,通过正交实验和单因素实验研究了镀液中 硫酸镍、次磷酸钠、柠檬酸钠和硼酸的质量浓度对镀层沉积速 度和镀层表面质量的影响 ,获得了最佳工艺参数 :ρ(硫酸镍 ) 30 g/L ,ρ(次磷酸钠 ) 20 g/L, ρ(柠檬酸钠 ) 25 g/L , ρ(硼酸 ) 38 g/L , ρ(复合添加剂 ) 15 mg/L,温度 ( 85 ±1 ) ℃,装载比 1. 5 dm 2 /L , pH 9,沉积时间 1～1. 5 h。金相照片显示 , N i2P化 学镀层表面由均匀的胞状颗粒组成 ,镀层致密 ,无空隙 ;镀层 截面照片和 300 ℃热震实验表明 ,镀层与基体结合力良好 ; EDS和 X -射线衍射图谱证明合金镀层中 P的质量分数为 10. 85% ,镀层呈非晶态结构。 关键词 :化学镀 ; N i2P;正交实验 ;沉积速度 中图分类号 : TG178　　　　　文献标识码 : A 文章编号 : 1004 - 227X (2005) 11 - 0015 - 04 O rthogona l test design and m icrom orphology ana lysis of N i2P electroless deposits / / L IANG Ping, WU M in, MA W en2tao Abstract: In the certain conditions of temperature, pH val2 ue, loading rate, electroless time and mass concentration of composite additive, the influences of mass concentration of nickel sulfate, sodium hypophosphite, sodium citrate and boric acid on deposition rate and surface quality were stud2 ied with orthogonal test and single factor test. The op tim ized parameters were gained as follows: 30 g/L nickel sulfate, 20 g/L sodium hypophosphite, 25 g/L sodium citrate, 38 g/L boric acid, 15 mg/L composite additive, (80 ±1) ℃, loading rate of 1. 5 dm 2 /L , deposition time of 1～1. 5 h. Metallograph shows that the surface of N i2P electroless de2 posit consists of even particles p resenting cystiform cell. The deposit is dense and porosity2free. Section photo and hot vi2 brative test show that the deposit has good adhesion with substrate. EDS spectrum and X2ray diffraction p rove that the deposit contains 10. 85% P by mass and has non2crystal structure. Keywords: electroless; N i2P; orthogonal test; deposition rate F irst2authorπs address: College of Mechanical Engineer2 ing, L iaoning University of Petroleum