B82422H1684K;B82422H1103K;B82422H1102K;B82422H1223K;B82422H1222K;中文规格书,Datasheet资料.pdfVIP

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B82422H1684K;B82422H1103K;B82422H1102K;B82422H1223K;B82422H1222K;中文规格书,Datasheet资料.pdf

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B82422H1684K;B82422H1103K;B82422H1102K;B82422H1223K;B82422H1222K;中文规格书,Datasheet资料

1 Please read the important notes at the end of this document Size 1210 (EIA) or 3225 (IEC) Rated inductance 1 to 680 H Rated current 61 to 1150 mA Construction Ferrite drum core Laser?welded winding Flame?retardant encapsulation Features Very high current handling capability Suitable for reflow soldering acc. JEDEC J?STD 020C lead?free, RoHS?compatible qualified acc. AEC?Q200 Applications Filtering of supply voltages, coupling, decoupling DC/DC converters / switch mode power supplies Automotive electronics Telecommunications Terminals Electro?plated Base material CuSn6 0,4m Cu; 1?2m Ag; 5?7m Sn (lead-free) Marking Marking on component: L value (in H) and tolerance of L value (coded) Date of manufacture (coded) Delivery mode 8mm blister tape, reel packing 180mm ? reel (2000 pcs) or 330mm ? reel (7500 pcs) Taping in accordance to IEC 60286?3. For details on taping and packing refer to data book “Chokes and Inductors” and to Epcos Homepage. SMT Inductors, SIMID Series B82422H SIMID 1210?H Hugo ist doof BNRB82422?H1*?3?7659 28.06.2006 h ttp ://o n e ic .c o m / Marking 2 Please read the important notes at the end of this document Dimensional drawing Layout recommendation Dimensions (mm) A B C D Reflow soldering 2,70 1,15 2,10 4,40 1) Soldering area, tinned Technical data and measuring conditions Electrical specifications at TA = 20°C Rated inductance LR Measured with impedance analyzer HP 4294A at frequency fL Q factor Qmin Measured with impedance analyzer HP 4294A at frequency fQ Rated current IR Maximum permissible DC with inductance decrease L/L0 10% and temperature increase of 45K at rated temperature of 105°C Self?resonance frequency fres,min Measured with network analyzer HP 8753 DC resistance Rmax measuring current IR Climatic category 55/150/56 to IEC 60068?1 Solderability lead-free to IEC 60068?2?58 and Jedec J?STD 002B / JESD22?B102D Resistance to soldering h