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CSP design rule-customer-V.pdf

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CSP design rule-customer-V

Presented by ASE Confidential / Security-B CSP-BGA (Sawing Type) Substrate Design Rule Center Design Engineering, ASE Group June 17, 2009 2 ? ASE Group. All rights reserved. ASE Confidential / Security-B Substrate Structure Normal Process Selective Gold Process Multi Bond (Double Bond,Triple Bond and Four Bond) PTH Via Design Blind Via Design Ring , Finger placement S/M design rule (1) ~(2) Finger Design Specification Trace Design Specification Outer Layer Trace (Normal Process) Outer Layer Trace (Selective Gold Process) Inner Layer Trace Content Wire Selection Rule 3 ? ASE Group. All rights reserved. ASE Confidential / Security-B Routing Specification (Normal) Solder Ball Size and Ball Pad/SM Opening The distance between ball edge and package edge Routing Specification (Blind Via Design) Content Etching Back Design Specification NPL or Selective Gold Specification Stub Less Design Specification 4 ? ASE Group. All rights reserved. ASE Confidential / Security-B Material Type Thickness Material Type Thickness B.T Resin CCL-HL832HS CCL-HL832NX(A- HS) 100+/-30 CCL-HL832HS CCL-HL832NX(A- HS) 100+/-30 Copper Nickel Plating 5~15 5~15 Gold Plating Soft Gold 0.5~1.5 Soft Gold 0.5~1.5 Solder Mask PSR4000 AUS303 PSR4000 AUS308 20+/-10 (on cu) PSR4000 AUS303 PSR4000 AUS308 30+/-10 (on cu) Copper in Hole 10MIN 10MIN Figure 12MIN 170+/-30 210+/-40 12MIN Substrate 2-Layer Material Type Thickness Material Type Thickness B.T Resin CCL-HL832HS CCL-HL832NX(A- HS) 150+/-30 CCL-HL832 CCL-HL832NX(A- EX) 250+/-30 Copper Nickel Plating 5~15 5~15 Gold Plating Soft Gold 0.5~1.5 Soft Gold 0.5~1.5 Solder Mask PSR4000 AUS303 PSR4000 AUS308 30+/-10 (on cu) PSR4000 AUS303 PSR4000 AUS308 30+/-10 (on cu) Copper in Hole 10MIN 15MIN Figure Depend on Inner Design 260+/-40 360+/-40 12MIN Substrate Substrate Structure – PTH Design 5 ? ASE Group. All rights reserved. ASE Confidential / Security-B Material Type Thickness B.T Resin CCL-HL832EX CCL-HL832NX(A-EX) 4