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A -Band Front-End With 3-D Integrated Cavity FiltersDuplexers and Antenna in LTCC Technolog.pdf

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A -Band Front-End With 3-D Integrated Cavity FiltersDuplexers and Antenna in LTCC Technolog

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL. 54, NO. 7, JULY 2006 2925 A V -Band Front-End With 3-D Integrated Cavity Filters/Duplexers and Antenna in LTCC Technologies Jong-Hoon Lee, Student Member, IEEE, Nobutaka Kidera, Gerald DeJean, Student Member, IEEE, Stéphane Pinel, Member, IEEE, Joy Laskar, Fellow, IEEE, and Manos M. Tentzeris, Senior Member, IEEE Abstract—This paper presents a compact system-on-package- based front-end solution for 60-GHz-band wireless commu- nication/sensor applications that consists of fully integrated three-dimensional (3-D) cavity filters/duplexers and antenna. The presented concept is applied to the design, fabrication, and testing of -band (receiver (Rx): 59–61.5 GHz, transmitter (Tx): 61.5–64 GHz) transceiver front-end module using multilayer low-temperature co-fired ceramic technology. Vertically stacked 3-D low-loss cavity bandpass filters are developed for Rx and Tx channels to realize a fully integrated compact duplexer. Each filter exhibits excellent performance (Rx: IL 2 37 dB, 3-dB bandwidth (BW) 3.5%, Tx: IL 2 39dB, 3-dB BW 3.33%). The fabrication tolerances contributing to the resonant frequency experimental downshift were investigated and taken into account in the simulations of the rest devices. The developed cavity filters are utilized to realize the compact duplexers by using microstrip T-junctions. This integrated duplexer shows Rx/Tx BW of 4.20% and 2.66% and insertion loss of 2.22 and 2.48 dB, respectively. The different experimental results of the duplexer compared to the individual filters above are attributed to the fabrication tolerance, especially on microstrip T-junctions. The measured channel-to-channel isolation is better than 35.2 dB across the Rx band (56–58.4 GHz) and better than 38.4 dB across the Tx band (59.3–60.9 GHz). The reported fully integrated Rx and Tx filters and the dual-polarized cross-shaped patch antenna functions demonstrate a novel 3-D deployment of embedded components equip