TI DM37x高性能应用处理器开发评估方案.docxVIP

TI DM37x高性能应用处理器开发评估方案.docx

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TIDM37x高性能应用处理器开发评估方案TIDM37x高性能应用处理器开发评估方案

TI DM37x高性能应用处理器开发评估方案TI 公司的DM37x系列是高性能应用处理器,基于增强的器件架构和采用TI的45nm工艺技术,与CortexTM-A8 Sitara和OMAP处理器兼容,MPU子系统,高达1-GHz ARM CortexTM-A8内核,NEON SIMD协处理器,高性能图像,视频,音频(IVA2.2?)加速子系统,高达800-MHz TMS320C64x+? DSP核,具有EDMA控制器(128个独立通路)以及视频硬件加速器,主要用在手提数据终端,导航,汽车娱乐,游戏,医疗图像,家庭自动化,工业控制,测试测量和单板机。本文介绍了DM37x系列主要特性,功能方框图和AM/DM37x评估模块(EVM)功能方框图,EVM 主板电路图,处理器模块电路图以及电源模块电路图。The DM37x family of high-performance, applications processors are based on the enhanced device architecture and are integrated on TI’s advanced 45-nm process technology. This architecture is designed to provide best in class ARM and Graphics performance while delivering low power consumption. This balance of performance and power allow the device to support the following example applications:Portable Data Terminals?Navigation?Auto Infotainment?Gaming?Medical Imaging?Home Automation?Human Interface?Industrial Control?Test and Measurement?Single board Computers?The device can support numerous HLOS and RTOS solutions including Linux and Windows Embedded CE which are available directly from TI. Additionally, the device is fully backward compatible with previous CortexTM-A8 Sitara and OMAP processors.This DM3730/25 Applications Processor data manual presents the electrical and mechanical specifications for the DM3730/25 Applications Processor. The information contained in this data manual applies to both the commercial and extended temperature versions of the DM3730/25 Applications Processor unless otherwise indicated. It consists of the following sections:? A description of the DM3730/25 terminals: assignment, electrical characteristics, multiplexing, and functional description? A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics? The clock specifications: input and output clocks, DPLL and DLL? A description of thermal characteristics, device nomenclature, and mechanical data about the available packagingThe device can support numerous HL

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