PFMEA_Format_LED Luminaire_0620.xls

PFMEA \a \b \c \d \e \f \g \h \i \j \k \l \m \n \o \p \q \r \s \t \u \v \w \x \y \z dd DIRECT E F 外观不良 appearence defect 无(None) ▼ 测量高度,根据实际高度修正程序. UMEate the prpgram according to the actual size 1.存放环境温湿度不符 Storage temperature and humidity envsoldering ironment are inappropriately. 2.没有防静电保护 No ESD protection 铬铁接地失效 The soldering iron fail to meeting the grounding 铬铁没接地线或地线开路 The soldering iron has no contact the grounding, or short circuit of the grounding 铬铁接地要求写入WI中 Write the requirements of the soldering iron to meet the grounding into W/I 作业前对铬铁进行点检 Check the soldering iron when start the assembly 产品外观不良 appearence defect 铬铁碰到LED soldering iron was bump into LED 潜在过程失效模式及后果分析（过程FMEA） Potential Failure Mode and Effects Analysis(P-FMEA) 锡膏搅拌不充分 The solder paster was not mixed properly 锡膏在钢网上放置时间过长 The time of the solder paste on the SS mesh was too long W/I中规定锡膏未使用时在钢网上放置时间 W/I have no identify the time of the solder paste on the SS mesh 发生异常时及时处理确认 Take actions in time once it happens 印锡漏印、偏位 No solder paste,solder paste shift 元件贴装欠品，偏位，竖立　　　　　　　　　Parts　missing, shifting,upright 钢网孔堵塞 The holes of the SS mesh was jammed 设定每4H手动清洁钢网一回 Clean the SS mesh every 4 hours manually 锡膏检查机对印刷状态进行检查 3X Visual Inspection / 基板偏位 The PCB board was not fixed properly. 调整最适合基板宽度的轨道 Adjusting the PCB board to correct location 锡膏规格用错 Wrong type of the solder paste 降低产品功能. The product function will be affected 操作员取用错误 Operator used wrong solder paste WI中体现锡膏规格型号 Show the type and name in WI 填写《锡膏使用管理记录表》 Make a record 无 None 5 灯板自动贴片(元件贴装位置及极性正确) 元件漏贴装、极性错 Missing components and wrong polarity during mounting 产品无功能 No function / 元件贴装程序设置错误；Wrong SMT program 1.SMT技术员依元件座标作成实装程序. The SMT technician make the sample according to the program 2.元件规格及元件位置按照BOM设定上料站位. The specs and the location of the components needs to matched with the BOM 1.对照程序管理一览表进行程序选用 1. Check the prog