基于MEMS工艺的高能量密度微电磁驱动器_张涛.pdf

15 6 Vol. 15 No. 6 2007 6 Optics and Precision Engineering Jun. 2007 100-92 X(2007) 06-0866-07 MEMS 1,2 1 1 1, 2 1 1 张 涛 , 吴一辉, 黎海文, 刘 波 , 张 平, 王淑荣 ( 1. 中国科学院长春光学精密机械与物理研究 应用光学国家重点实验室, 吉林长春130033; 2. 中国科学院研究生院, 北京100039) : ( MEMS) , ( Cu) , Cu ; 20 Lm , ; ; , NiFe 10 mm@ 10 mm@ 0. 38 mm, 22@ 2( 60 Lm @ 60 Lm1 16 mm) NiFe 3 mm@ 3 mm @ 0. 2 mm : 0. 3 A , 50 mN : , , : MEMS; 微型电磁驱动器; 高能量密度; 多匝双层平面微线圈;厚NiFe 合金镀层 :TM57;TP271. :A Micro electromagnetic actuator with high energy density based on MEMStechnology 1,2 1 1 1, 2 1 1 ZHANG Tao , WU Y-i hui , LI Ha-i wen , LIU Bo , ZHANG Ping , WANG Shu-rong (1.National Key Laboratory of App lied Op tics, ChangchunInstitute of Op tics, Fine Mechanics and Physics , ChineseAcade y of Sciences, Changchun 130033, China; 2. GraduateSchool of the ChineseAcade y of Sciences, Beij ing 100039, China) Abstract: A fabricating technology for high energy density micro electromagnetic actuator based on Micro Elec- tron Mechanics System( MEMS) is introduced. The main steps on MEMS technology are as follow s: Firstly, etching plating trenches of mult-i turn double planar microcoils and permalloy ( NiFe) core into silicon wafersprior to electrode position, a seedlayer of copper must is deposited on the w afer; secondly, when the thick of seed lay- er reaches to about 20 Lm by electroplating, peeling the surface plating on the wafer and coating the core by pho- toresist, electroplating the coil in the groove; thirdly, when the coil groove is filled with copper