Dynamic anti-plane analysis for two symmetrically interfacial cracks near circular cavity in piezoelectric bi-materials.pdf

Appl. Math. Mech. -Engl. Ed., 35(10), 1261–1270 (2014) Applied Mathematics DOI 10.1007/s10483-014-1891-9 and Mechanics c Shanghai University and Springer-Verlag Berlin Heidelberg 2014 (English Edition) Dynamic anti-plane analysis for two symmetrically interfacial cracks near circular cavity in piezoelectric bi-materials∗ A. HASSAN1, Tian-shu SONG ()2 (1. Department of Civil Engineering, Military Technical College, Cairo 11787, Egypt; 2. College of Aerospace and Civil Engineering, Harbin Engineering University, Harbin 150001, P. R. China) Abstract The present paper is exposed theoretically to the influence on the dynamic stress intensity factor (DSIF) in the piezoelectric bi-materials model with two symmet- rically permeable interfacial cracks near the edges of a circular cavity, subjected to the dynamic incident anti-plane shearing wave (SH-wave). An available theoretical method to dynamic analysis in the related research field is provided. The formulations are based on Green’s function method. The DSIFs at the inner and outer tips of the left crack are obtained by solving the boundary value problems with the conjunction and crack- simulation technique. The numerical results are obtained by the FORTRAN language program and plotted to show the influence of the variations of the physical parameters, the structural geometry, and the wave frequencies of incident wave on the dimensionless DSIFs. Comparisons with previous work and between the inner and outer tips are con- cluded.