化学镀镍过程的动电位及循环伏安研究英文.pdfVIP

Potentiodynamic polarization and cyclic voltammetric studies of electroless nickel plating process S. Karthikeyan ( Latha Mathavan Engineering College, Latha Mathavan Nagar, Kidaripatti, Madurai 625301, Tamilnadu, India ) Abstract: Electroless nickel plating process is the controlled 摘 要：化学镀镍是一个采用合适的还原剂（如次磷酸钠）使 autocatalytic reduction of nickel ions using suitable reducing 镍离子在某催化界面上可控地自催化还原的过程，所生成的膜 agent such as sodium hypophosphite on certain catalytic 层附着良好，应用广泛。以次磷酸盐作为还原剂时，化学镀镍 surfaces, which results in the production of well-adherent 的沉积速率通常低于20 μm/h ，故研究了在有少量硫脲或其衍生 coatings for a number of applications. Usually the rate of 物作为加速剂的条件下，次磷酸盐体系中镍的化学沉积过程。 electroless deposition of nickel with hypophosphite as 通过动电位阴、阳极极化和循环伏安研究，评价了镀覆过程中 reducing agent is below 20 microns per hour. Hence the 各种加速剂的性能。结果表明，所研究的硫化物都有明显的阳 electroless deposition of nickel in hypophosphite solution 极去极化作用。各种加速剂性能的优劣顺序为：甲基硫脲 was investigated in the presence of thiourea or its derivatives N,N′– 乙烯硫脲 烯丙基硫脲 乙酰硫脲 对甲苯基硫脲 as accelerator at a small concentration. The performances of 硫脲 二苯基硫脲。此外，氨基硫脲的性能优于巯基琥珀酸。 various accelerating agents during the plating process were 关键词：化学镀镍；动电位极化；循环伏安；加速剂；硫脲及 evaluated by potentiodynamic polarization (both anodic and 其衍生物 cathodic) and cyclic voltammetric studies. The results showed that all the sulfur compounds studied have an obvious anodic depolarizing effect. The performances of the 1 Introduction accelerators are in the following descending order: The studies on electroless nickel and its composites methylthioure