reflower.pptVIP

Lead-Less Solders,Japanese Electrical Maker using StatusPlan of Japanese Electrical maker History of Chip size change at Sony Screen Printer(1) The difference from Sn-Pb solder ① may no change for Printability ② Tackkingability may be weaker ③ may need to change for 0201 Chip Pad on PCB and opening size on the stencil Required condition to Chip Mounter for 0201 chip with lead-less solder ② Control of placement height Soldering N/G may occur frequently, if no control for the placement height 　?the solder paste spread out from the land could be the cause of soldering N/G, as the surface tension is less than　 　 eutectic solder. * Lead-less Soldering Process With 0201 What has been done to introduce Lead-less Soldering Process and 0201 Placement…..? Expected conditions to check What is Lead-less solder? 　　　What is its ingredient and its characteristic? With Screen Printer... 　　　What is the difference from Eutectic? 　　　How about the material of stencil and the shape 　　 　　　of its Opening With Chip Mounter... 　 What is the required accuracy? 　　　How about the nozzles? With Reflow Oven... 　　　What is the required profile? 　　　How about the structure? Assign one division to be in charge, for the entire company. 　　　① call all the Solder Paste maker, then obtain the solder paste available at that point in time 　　　　　　　?Solderability 　　　　　　　?Strength of Soldering joint 　　　　　　　?Printability 　　　　　　　?Tackkingability 　　　　② investigation of Patent 　　　　　　　?3-elements-alloy(Sn/3.0Ag/0.5Cu) 　　　　　　　　other company already obtained 　　　　　　　?4-elements-alloy(Sn/2.5Ag/1Bi/0.5Cu) no company obtained Selection of Lead-less Solder paste Features of Lead-free Solder (1) Proposed types of lead-free solder Composition Melting point Soldering work temperature Sn-Pb eutectic 183 ° C 220 to 230 ° C Sn-Ag 221 ° C 225 to 245 ° C Sn-Ag-Bi-Cu 215 to 222 ° C 225 to 24