外文资料--THREEDIMENSIONALFLOWANALYSISDURINGINJECTIONMOLDINGPROCESSFORSTACKED-DIEPACKAGES.pdfVIP

Three Dimensional Flow Analysis During Injection Molding Process For Stacked-Die Packages Sung-won Moona, Cheng Yangb, Zhihua Lia, and Anthony Fischera aIntel Corporation 5000 W. Chandler Blvd, M/S CH5-157 Chandler AZ, 85226 Phone: 480-552-7930 bIntel Technolgoy Development (Shanghai) Co., Ltd Abstract where iv is the velocity vector, p the density, 77 the viscosity, The three-dimensional numerical simulation has been p the static pressure, r the stress tensor, and y the shear rate. performed to study mold flow characteristics during injection Also the first term in the right hand side in equation (3) is the molding process of stacked die packages. The modeling energy generation rate due to compression/expansion of the results revealed that flow front shape is highly non-uniform polymer melt followed by the energy generation rate due to around the die stack-up units and is dependent on various viscous dissipation. The last term in equation (3) is the design parameters including mold cap clearance, mold exothermic heat generation rate due to curing, where a is the compound material properties, as well as the die stack-up degree of cure and H is the total heat of the cross linking