聚双胍-环氧树脂体系潜伏性固化过程.pdfVIP

第 66 卷 第 1期 化 工 学 报 Vol.66 No.1 January 2015 2015 年 1 月 CIESC Journal ·464 · 聚双胍/环氧树脂体系潜伏性固化过程 王权，史铁钧，张焱，虞伕，刘建华 （合肥工业大学化工学院，安徽合肥 230009 ） 摘要：用己二胺与双氰胺熔融缩聚，合成了一种新型潜伏性环氧树脂固化剂，并研究了其与环氧树脂的固化过程。 1 用 FTIR、XPS、 H NMR 分析了固化剂的结构；用 DSC 分析得到了固化剂与环氧树脂的适宜配比、固化体系的 适宜固化温度及固化动力学参数；通过 XRD 分析了固化物的相结构；通过 TG 分析了固化物的热稳定性。结果表 明，与双氰胺环氧树脂固化体系相比，固化温度降低近 70℃，同时潜伏性能良好，30 d 内固化度少于 10%，热稳 定性能良好，热分解温度超过 300℃。 关键词：聚六亚甲基双胍；改性双氰胺；环氧树脂；潜伏性固化剂；合成；动力学；稳定性 DOI ：10.11949/j.issn.0438-1157 中图分类号：O 631 文献标志码：A 文章编号：0438—1157 （2015）01—0464—07 Latent curing of polybiguanide/epoxy resin WANG Quan, SHI Tiejun, ZHANG Yan, YU Fu, LIU Jianhua (School of Chemical Engineering，Hefei University of Technology，Hefei 230009，Anhui ，China) Abstract: A new latent curing agent for epoxy resin was synthesized via melted polycondensation of dicyandiamide (DICY) and hexamethylenediamine. The structure of the curing agent was analyzed with FTIR, XPS, 1H NMR. The optimum ratio, suitable curing temperature and curing kinetic parameters of this epoxy resin curing system were studied with DSC. The phase structure of the cured epoxy resin was investigated with XRD. The thermostability of the cured epoxy resin was obtained by TG. Comparing with the DICY/EP curing system, curing temperature dropped by nearly 70℃. Latency performance was fine as curing degree was less than 10% within 30 days. Thermostability was nice as thermal decomposition temperature exceeded 300 ℃. Key words: polyhexamethylene biguanidine; mod