Sn-Cu合金电沉积行为及添加剂影响.pdfVIP

20 5 2010 5 Vol.20 No.5 The Chinese Journal of Nonferrous Metals May 2010 1004-0609(2010)05-1006-07 Sn-Cu 1, 2 1, 2 1, 2 1, 2 (1. 410083 2. 410083) Sn-CuSEM EDSSn-CuSn-Cu −600~−750 mVSn-CuScharifker-Hills −700 mVSn2+ 6.435 −6 2 10 cm /s 0.5%~2.0%() Sn-Cu TQ172.84 A Electrodeposition behavior of Sn-Cu alloy and effect of additives on deposition process HU Wei1, 2, TAN Cheng-yu1, 2, CUI Hang1, 2, ZHENG Zi-qiao1, 2 (1. Educational Key Laboratory of Non-ferrous Metal Materials Science and Engineering, Central South University, Changsha 410083, China; 2. School of Materials Science and Engineering, Central South University, Changsha 410083, China) Abstract: The electrodeposition of Sn-Cu alloy system on the glass carbon electrode was investigated by cyclic voltammetry (CV) and chronoamperometry (CA). The effect of citric acid and thiourea additives on Sn-Cu alloy codeposition was discussed by cathodic polarization curve, SEM observation and EDS analysis. The results indicate that the electrodeposition process of Sn-Cu is an irreversible process controlled by diffusion, and the codeposition of Sn-Cu alloy system in the initial stage follows Scharifker-Hills (SH) instantaneous nucleation/growth mechanism in the potential range of −600− −750 mV. With increasing the overpotential, the activity-point for nucleation increases, and the nucleation relaxation time reduces. Wh