硅微陀螺仪的芯片级温控设计.docVIP

 硅微陀螺仪的芯片级温控设计# 杨波，徐露，曹慧亮* （东南大学仪器科学与工程学院，南京 210096） 5 10 摘要：研究了一种新的基于芯片级温控技术的硅微陀螺仪温度误差校正技术。该技术通过集 成在陀螺芯片上的微型加热器和温度传感器对陀螺敏感结构进行恒温控制来抑制陀螺的温 度误差。相比于传统的温控方法，该方式具有响应时间短、灵敏度高、功耗低、重复性和温 度均匀性好等特点。采用 Ansys 软件分析了芯片级温控的稳态温度和瞬态温度响应，以及不 同环境温度下的功耗。仿真表明，在 0.0989W 功耗下，芯片级温控陀螺在 10s 内温度达到 59左右，陀螺结构温差在 0.7内。最后，采用 DDSOG 的干法工艺和湿法刻蚀工艺相结 合工艺对芯片级温控陀螺样品进行了加工。 关键词：硅微陀螺仪; 温度误差; 芯片级温控 中图分类号：U666.123 15 The Design of On-chip Temperature Control of the Silicon Micro-gyroscope YANG Bo, XU Lu, CAO Huiliang (School of Instrument Science Engineering, Southeast University, Nanjing 210096) 20 25 30 35 Abstract: In this paper, a new temperature error correction technology based on on-chip temperature control for the silicon micro-gyroscope is presented. The proposed architecture utilizes on-chip micro-heater and temperature sensor to control the temperature of micro-gyroscope, which is used to correct the temperature error of the micro-gyrocope. Comparing to the traditional technology of temperature control, the new method has more shorter response time, higher sensitivity, lower power consumption, better repeatability and temperature uniformity and so on. Steady-state and transient response of temperture and power consumption of the on-chip temperature control is analysed by Ansys soft. The simulation results show that the temperature of the micro-gyroscope reach the about 59 ℃ within the 10s in the power consumption of 0.0989 W and temperature difference of the micro-gyroscope is within the 0.7℃. Finally, the micro-gyroscope with the on-chip temperature control is processed by the DDSOG and wet etching process. Key words: silicon micro-gyroscope;temperature error;on-chip temperature control 0 引言 温度变化将引起硅微陀螺仪的材料属性、尺寸大小、品质因数以及残余应力等的改变， 直接影响到硅微陀螺仪的零偏温度系数和标度因数温度系数等关键指标 [1-2] 仪精度的不断提高，由环境温度变化和硅微陀螺仪芯片中热量累积引起温度漂移误差变得越 来越突出，温度漂移误差已经成为限制硅微陀螺仪性能的主要误差之一。因此，硅微陀螺仪 温度误差校正技术研究成为本领域研究的热点之一 [3-4] 。 40 本文提出一种新型的芯片级温控方法来校正硅微陀螺仪的温度误差，该方式具有响应 快、灵敏度高、重复性好和高度集成化的特点，在无需对现有硅微机械加工工艺进行较大改 动的情况下，实现简便实用、高效可靠的硅