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Development of MEMS Vertical Planar Coil Inductors Through Plastic Deformation Magnetic Assembly (PDMA) Jinghong Chen*, Jun Zou**, Chang Liu** and Sung-Mo (Steve) Kang*** Agere Systems, Holmdel, NJ 07733 Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801 Jack Baskin School of Engineering, University of California, Santa Cruz ABSTRACT This paper presents the results of the development of a vertical planar coil inductor. The planar coil inductor is first fabricated on silicon substrate and then assembled to the vertical position by using a novel 3-Dimensional bathscale self-assembly process (Plastic Deformation Magnetic Assembly (PDMA)). Inductors of different dimensions are fabricated and tested. The S-parameters of the inductors before and after PDMA are measured and compared,demonstrating superior performance due to reduced substrate effects and also increased substrate space savings for the vertical planar coil inductors. Keywords: MEMS, planar coil inductor, quality factor,PDMA, resonance frequency. 1 INTRODUCTION With the development of integrated wireless communication systems, on-chip inductors with satisfactory performance (enough quality factor and selfresonant frequency) are required. However, the conventional planar coil inductor suffers from substrate losses and parasitics since it is directly fabricated onto conductive substrate over a very thin dielectric layer [1]. In recent years, much effort has been made to improve the performance of planar coil inductors. Metal materials with higher conductivity or thicker metal layers are utilized to decrease the resistance of the coil. Meanwhile,different methods are proposed to reduce the substrate loss and parasitics, including removing the substrate underneath the inductor [2], applying a thick polymide layer to separate the inductor farther away from the substrate [3], etc. More recently, planar coil inductors levitated above the substrate are reali